Latest news and trends about tech

Vietnam’s FPT to absorb Poland software unit of Japan’s Nippon Seiki, extends car-software service to Europe

The Japanese unit of Vietnam’s technology giant FPT will take on the Polish software-design operations of Japan's Nippon Seiki, extending an automotive-software partnership between the two companies from Japan and Vietnam into Europe.

Databricks’ Kunal Taneja on moving AI agents from pilot to production [Q&A]

Databricks' Kunal Taneja discusses the data, governance, cost and human-approval controls enterprises need to move AI agents from controlled pilots into production.

ROOMIE launches integrated payment gateway for hotels in Malaysia

Malaysia-based hotel technology company ROOMIE has launched an integrated payment gateway that brings regional payment methods into hotel guest journeys.

Simpaisa, Tencent Cloud assess large-scale fintech cloud transformation

Simpaisa and Tencent Cloud are assessing a cloud transformation covering compute, Kubernetes, databases, messaging, monitoring and security infrastructure.

MyRepublic launches Hyperpeer game-routing service in Singapore and Malaysia

MyRepublic has launched Hyperpeer, a subscription service that optimizes routing for supported online games and is available to users in Singapore and Malaysia regardless of their internet provider.

Nemetschek signs ITE and Singapore Polytechnic MOUs on AI-ready built-environment skills

Nemetschek has signed training agreements with ITE and Singapore Polytechnic focused on BIM, AI-assisted compliance, model validation, and digital-twin workflows.

KKR-Singtel consortium completes takeover of Singapore’s STT GDC at $10.9B

A consortium, led by U.S.-based investment firm KKR with Singapore's Singtel, has completed its acquisition of Singapore's STT GDC, taking full ownership of the data-center operator, STT GDC said in a statement on Wednesday.

SEMI and Silicon Catalyst partner to connect semiconductor startups with global industry networks

SEMI and Silicon Catalyst have formed a partnership at SEMICON Taiwan to expand startup programs, investor engagement, and industry connections across semiconductor markets.

TRUMPF targets glass-substrate bottleneck in next-generation AI chip packaging

TRUMPF says its HiPIMS coating technology can improve the reliability of through-glass vias, a manufacturing challenge for emerging AI-chip packaging designs.

Zyxel Networks rolls out Nebula 20.10 with identity federation and streamlined network management

Zyxel Networks has released Nebula 20.10, adding identity federation, Passkey login, improved network topology tools, centralized MSP event logs and one-click device replacement.