Asia

Taiwanese electronics manufacturing services company Hotayi Electronic (M) Sdn. Bhd. has broken ground on MYR 500 million ($113 million) smart factory expansion in Malaysia.

Temu, the global e-commerce platform of China’s PDD Holdings, and dLocal, the cross-border payment platform connecting global merchants to emerging markets, have announced a strategic partnership to expand their payments in Africa, Asia, Latin America.

HitPay, a Singapore-based fintech firm, has partnered with NPCI International Payments Limited (NIPL), an India-based payments firm, to integrate the unified payments interface (UPI) into its platform.

HashKey Capital, a Hong Kong-based institutional asset manager investing in blockchain technology and digital assets, has obtained a Type 1 license from the Hong Kong Securities and Futures Commission (SFC), further expanding its regulated capabilities under the SFC.

The GBA Tour 2025 is set to take place in several dynamic cities including Macao, Shenzhen, Hong Kong and other cities in the GBA region from May 26-28, 2025.

NTT DATA, a Japan-based digital business and technology services firm, announced Monday the commissioning of its Malaysia, India, Singapore Transit (MIST) submarine cable system by June 2025.

RedotPay, a crypto payment platform based in Hong Kong, has announced the successful close of a $40 million Series A funding round led by Lightspeed following their commitment in December 2024.

Seraya Partners said Monday that energy transition, digitalization, and regionalization, are driving new investment opportunities across developed and emerging Asia, as the region continues to drive global economic growth.

The Hong Kong University of Science and Technology (HKUST) and Shanghai Industrial Investment (Holdings) Co., Ltd. (SIIC) have announced the establishment of the Hong Kong Biotechnology Fund (HKBF) to foster innovation in the life sciences sector.

Terabase Energy, a global digital and automation solutions for utility-scale solar power, has announced the closing of its $130 million Series C financing round.