AI
Nemetschek signs ITE and Singapore Polytechnic MOUs on AI-ready built-environment skills
Nemetschek has signed training agreements with ITE and Singapore Polytechnic focused on BIM, AI-assisted compliance, model validation, and digital-twin workflows.
September 3, 2026
SEMI and Silicon Catalyst partner to connect semiconductor startups with global industry networks
SEMI and Silicon Catalyst have formed a partnership at SEMICON Taiwan to expand startup programs, investor engagement, and industry connections across semiconductor markets.
September 3, 2026
TRUMPF targets glass-substrate bottleneck in next-generation AI chip packaging
TRUMPF says its HiPIMS coating technology can improve the reliability of through-glass vias, a manufacturing challenge for emerging AI-chip packaging designs.
September 3, 2026
Asia,TNGlobal Q&A and Interviews,AI,Enterprise
Yang Li of Vialto on where human judgment still matters in AI-assisted global mobility [Q&A]
Vialto Partner Yang Li discusses where AI can support global mobility and immigration workflows, where human judgment remains essential, and how organizations should approach transparency, privacy and accountability.
September 3, 2026
Alibaba joins Malaysia’s AI untuk Rakyat program with MuleRun and WonderClip
Alibaba is making MuleRun and WonderClip available through Malaysia's AI untuk Rakyat initiative, which aims to give 100,000 people aged 18 to 30 access to AI learning and selected tools.
September 2, 2026
Alipay+ and S&P Global survey finds trust gap as AI moves closer to payments
A 6,000-consumer survey across nine markets found strong use of AI for travel discovery but much lower interest in autonomous payment decisions, with privacy and control remaining key concerns.
September 2, 2026
News,Investments,AI,Enterprise
Malaysia’s nanoSkunkWorkX raises $2M to advance AI chip packaging materials
Malaysian deep-tech startup nanoSkunkWorkX has raised US$2 million in a seed round led by Singapore's Tin Men Capital to move its semiconductor materials technology toward partner qualification.
September 2, 2026
DayOne, TNB explore up to 1.5 GW on-site power for Selangor data center expansion
DayOne and TNB GenCo are studying up to 1.5 GW of dedicated on-site generation and battery storage for a new data center development in Selangor.
September 2, 2026
Superbench integrates HitPay payments into AI customer engagement platform
Superbench has integrated HitPay's payment infrastructure to connect customer enquiries, bookings and checkout for B2C service businesses.
September 2, 2026
eBay, OpenAI and TikTok join Asia Tech Alliance
The Asia Tech Alliance has added eBay, OpenAI and TikTok, bringing digital commerce, frontier AI and platform-policy perspectives into the regional technology industry group.
September 2, 2026












