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Samsung breaks ground on $4.5B HBM packaging plant

Samsung Electronics has broken ground on a 6 trillion won HBM packaging plant in Asan, South Korea, with operations planned for June 2028.

November 15, 2026

EnterpriseNewsAIInvestmentsSouth KoreaAsiaDeep Tech

Samsung breaks ground on $4.5B HBM packaging plant

November 15, 2026

On Location

November 15, 2026

Samsung breaks ground on $4.5B HBM packaging plant

EHang completes Sri Lanka’s first human-carrying eVTOL flights

November 15, 2026

Nvidia reaffirms 260,000-GPU supply plan for South Korea

November 15, 2026

AI Rudder launches CALL-E voice agent for phone calls

November 14, 2026

Four Southeast Asian Central Banks sign MOU to strengthen local currency transactions

November 13, 2026

Major Player

October 28, 2021

Deploying modern enterprise services in the cloud

Deploying modern enterprise services in the cloud

October 28, 2021

Grab wants to be the future of retail

June 9, 2020

Traditional retailers need digital transformation to keep up with consumers

September 20, 2018

Cross Border

November 15, 2026

Samsung breaks ground on $4.5B HBM packaging plant

EHang completes Sri Lanka’s first human-carrying eVTOL flights

November 15, 2026

Nvidia reaffirms 260,000-GPU supply plan for South Korea

November 15, 2026

AI Rudder launches CALL-E voice agent for phone calls

November 14, 2026

Four Southeast Asian Central Banks sign MOU to strengthen local currency transactions

November 13, 2026