Hong Kong Exchanges and Clearing
News,Asia,Deep Tech,China,Investments
Kinwong raises HK$5.1B in Hong Kong listing
Shenzhen-listed printed circuit board maker Kinwong raised about HK$5.1 billion in a Hong Kong offering and ended its first trading day above the issue price.
September 29, 2026
Kinwong raises HK$5.1B in Hong Kong listing
September 29, 2026
Samsung affiliates commit $1B to Helix AI infrastructure
September 29, 2026
Sumsub launches APAC Agentic AI Council on governance and agent identity
September 29, 2026
Samsung affiliates commit $1B to Helix AI infrastructure
September 29, 2026
Sumsub launches APAC Agentic AI Council on governance and agent identity
September 29, 2026



