Deep Tech
Datacom market boom to boost Malaysia’s tech space – Kenanga
Kenanga Research said Tuesday that the global datacom market boom will spur Malaysia's technology space.
Hong Leong sees strong global semi demand, structural tailwinds to underpin Malaysia’s OSATs, equipment players
Hong Leong Investment Bank Research said Monday that strong global semi demand and structural tailwinds (China+1, supply chain localization) will underpin a solid outlook for most outsourced semiconductor assembly and tests (OSATs) and equipment players in Malaysia.
Information and communication sub-sector leads Malaysia’s services approved investments in 2025
The information and communication4 sub-sector led the surge of Malaysia's services approved investments in 2025 with MYR 152.9 billion ($38.73 billion).
Singapore’s Hanic sets up new IC design and advanced packaging hub in Penang
Hanic, a Singapore-based semiconductor technology firm, has announced a strategic expansion in Penang, Malaysia, to establish a center for integrated circuit (IC) design and advanced packaging design.
Malaysia steps up push into IC design, advanced packaging and other high-value technologies
The Ministry of Science, Technology and Innovation (Mosti), through Mimos Bhd, is sharpening its focus on integrated circuit (IC) design, advanced packaging and other high-value technologies as Malaysia pushes to deepen its role in the semiconductor value chain.
StateSquare Capital to acquire controlling stake in Singapore’s Advanced Integrated Manufacturing
Singapore's private equity firm StateSquare Capital is acquiring a controlling stake in Advanced Integrated Manufacturing Corp. Pte Ltd (AIM), a Singapore-based aerospace and defense electronics manufacturing services (EMS) platform.
SoftBank and AMD to jointly validate utilization of AMD Instinct GPU for next generation AI infrastructure
Japan-based SoftBank Corp., together with the United States-based technology firm Advanced Micro Devices, Inc. (AMD), commenced the joint validation of utilizing AMD Instinct graphics processing units (GPUs) in advancing next generation AI infrastructure computing resources.
Taiwan’s Chipbond Technology strengthens Malaysia’s advanced semiconductor ecosystem with $200M new Penang facility
Chipbond Technology Corporation, a Taiwan-based provider of semiconductor packaging and testing services, has on Monday marked the official opening of its new advanced manufacturing facility, Chipbond Technology Malaysia Sdn. Bhd., located in Valdor Industrial Park, Batu Kawan, Penang, Malaysia.
Japan’s Menicon advances high-value ophthalmic manufacturing in Malaysia with $250M smart factory launch
Menicon Malaysia Sdn. Bhd., a wholly owned subsidiary of Japan-based Menicon Co., Ltd., and a global provider of comprehensive ophthalmic solutions spanning lens materials, design and lens care products, have on Thursday officially launched its MYR 1 billion ($250 million) new manufacturing plant at the Kulim Hi-Tech Park.
BIMB sees opportunities as Malaysia’s moving up the semiconductor value chain
BIMB Securities has maintained a neutral outlook on Malaysia's broader technology sector but remain bullish on fabless semiconductor firms as Malaysia's moving up the semiconductor value chain.
