Deep Tech
AI,Analysis,Malaysia,Deep Tech
Malaysia semiconductor sector gains from China+1 Shift, AI data center demand – HLIB
Malaysia’s semiconductor industry is benefiting from accelerating China+1 supply chain diversification, deeper localization by global semiconductor equipment makers and rising demand for optical and power semiconductors tied to artificial intelligence (AI)-driven data center expansion, while a recovery at Intel is also providing support to the sector, Hong…
May 22, 2026
Hisense and East Timor ink partnership to to advance digitalization, sustainable development
Chinese electronic firm Hisense and East Timor have signed strategic cooperation agreement, joining hands to advance digitalization and sustainable development.
May 22, 2026
Capital A’s ADE secures $100M financing from QNB to accelerate expansion
Asia Digital Engineering (ADE), the maintenance, repair and overhaul (MRO) subsidiary of Malaysia-based Capital A, announced Friday that it has secured a $100 million financing facility from QNB Group, a financial institutions in the Middle East and Africa, to accelerate its expansion.
May 22, 2026
Gobi-backed Malaysian IC firm SkyeChip jumps in IPO debut
Malaysia-based integrated circuit firm SkyeChip soared in its main market debut on Wednesday after the firm raised MYR 352 million ($88.62 million) from the initial public offering (IPO).
May 20, 2026
TDK to acquire Malaysia’s lithium-ion rechargeable batteries firm Linergy Power at $240M
Japanese electronics firm TDK will acquire 100 percent of the ordinary shares of Malaysia's lithium-ion rechargeable batteries firm Linergy Power Sdn Bhd at $240 million.
May 20, 2026
VNU advances $70M national semiconductor lab as Intel transfers chip equipment
Vietnam National University Hanoi (VNU Hanoi) is speeding up the construction of a national semiconductor laboratory worth $70 million, as Intel and Intel Products Vietnam (IPV) have transferred chip assembly and testing equipment to the university and Saigon Hi-Tech Park.
May 13, 2026
Malaysia’s semiconductor firm FusionAP raises $2M to expand advanced semiconductor packaging
FusionAP Sdn Bhd, a Malaysia-based advanced semiconductor packaging company, has raised $2 million in a pre-seed funding round co-led by Vertex Ventures Southeast Asia & India and Southern Capital Group.
May 13, 2026
Qualcomm opens R&D center in Vietnam to expand high-tech research
Qualcomm Technologies opened a new research and development (R&D) center in Hanoi, marking an expansion of the U.S. technology company’s high-tech research operations in the country, Vietnam's Ministry of Science and Technology said on Tuesday..
May 12, 2026
Malaysia eyes 7 percent global advanced packaging share by 2035
Malaysia is targeting a 7 percent share of the global advanced semiconductor packaging market by 2035, as the government accelerates efforts to move the industry up the value chain under its National Semiconductor Strategy (NSS).
May 11, 2026
MIDA positions Malaysia as key semiconductor supply chain hub in JS-SEZ
The Malaysian Investment Development Authority (MIDA) has reinforced Malaysia’s role as a strategic semiconductor supply chain partner under the Johor–Singapore Special Economic Zone (JS-SEZ), leveraging collaboration with global industry players to strengthen resilience, localization and long-term competitiveness.
May 8, 2026












