Deep Tech
Vietnam to host SEMIEXPO chip exhibition in December, drawing global firms
Vietnam will host SEMIEXPO Vietnam 2026, an international semiconductor exhibition, in Ho Chi Minh City on December 13-14, drawing some 200 companies and global chip leaders,
Seeing Machines demonstrates real-time 3D human understanding for Physical AI on NVIDIA Jetson Thor
Seeing Machines says its Human Mesh Recovery technology can reconstruct people in 3D in real time on NVIDIA Jetson Thor, targeting robotics and Physical AI systems that operate around humans.
Taiwan’s AVC plans $500M Vietnam expansion, R&D center amid AI-cooling boom
Asia Vital Components (AVC), a Taiwanese maker of cooling systems for computers and AI servers, plans to invest about $500 million more in Vietnam and build a research-and-development center there.
DeepSeek and Huawei open Ascend AI programming tools
DeepSeek and Huawei have developed open-source compute, communication and programming tools for Huawei's Ascend AI chips.
MBSB sees talent shortage to limit Malaysia’s technology sector earnings growth
MBSB Research said on Tuesday that talent shortage will limit the earnings growth for Malaysia's technology sector.
Japan’s TOPPAN, US’ Broadcom open Singapore’s first high-end AI-chip substrate plant
A joint venture between Japan's TOPPAN and U.S. chipmaker Broadcom opened Singapore's first plant for high-end FC-BGA chip substrates on Tuesday, a component in short supply as demand for AI processors surges.
Cloudflare plans public certificate authority for post-quantum web
Cloudflare plans to become a public certificate authority supporting conventional TLS certificates and post-quantum Merkle Tree Certificates.
South Korea’s LS Eco Energy to invest $8M in Vietnam rare-earth samarium plant
LS Eco Energy, under South Korean chaebol LS Group, will establish a subsidiary in Vietnam to produce rare-earth samarium metal for defense and high-tech uses.
Kinwong raises HK$5.1B in Hong Kong listing
Shenzhen-listed printed circuit board maker Kinwong raised about HK$5.1 billion in a Hong Kong offering and ended its first trading day above the issue price.
Advanced packaging is Malaysia’s next test in AI semiconductor value chain – AMRO
Malaysia’s growing role in advanced semiconductor packaging could help the country capture more value from the artificial intelligence (AI) boom, but the next challenge will be ensuring that foreign investment translates into higher domestic productivity, technology ownership and skilled employment, the ASEAN+3 Macroeconomic Research Office (AMRO) said on…
