Samsung Electro-Mechanics Vietnam (SEMV), under South Korea’s Samsung Electro-Mechanics (SEM), will expand activities in Vietnam by manufacturing Ultra Large Flip Chip Ball Grid Array (UL FCBGA) to serve AI servers and large data centers.

SEMV made the update in a filing with Vietnam’s ministry-run National Business Registration Portal dated October 8. Previously, SEMV produced UL FCBGA to serve robots, autonomous vehicles, and smart electronic products. SEMV did not provide any other detail.

The changes came a week after SEM announced in late September that it would invest KRW6.78 trillion won ($4.9 billion) to expand production of chip-packaging substrates in South Korea and Vietnam. The investment features KRW4.27 trillion in South Korea and KRW2.51 trillion in Vietnam.

SEM said the expansion would let it meet global customers’ demand for larger supply over the medium and long term. SEMV, based in Thai Nguyen province, has already produced package substrates in Vietnam, part of a build-up there since 2021.

Samsung Electronics plans to invest $1 billion in new capital in Vietnam in 2026, after cumulative investment in the country reached $24 billion by end of 2025, CFO of Samsung Electronics Park Soon Cheol said in July.

Samsung Electro-Mechanics to invest $4.9B in AI-chip substrates, including $1.8B for Vietnam