Malaysia’s national applied research and development center MIMOS Berhad and the Global Electronics Association have recently signed a memorandum of understanding (MoU) to collaborate in strengthening Malaysia’s electronics and semiconductor ecosystem, with a focus on advanced electronic packaging (AEP), industry alignment, and global best practices.
Global Electronics Association said in a statement on Tuesday that the MoU outlines a framework to support this transition within Malaysia’s electronics manufacturing sector.
The MoU establishes a strategic collaboration focused on advancing AEP through advisory and insights (global market trends and strategic guidance); standards and best practices (development of guidelines and standards; capability building (co-hosted workshops and knowledge-sharing initiatives); technical support (validation of design, assembly, and packaging technologies); ecosystem engagement (collaboration with industry, academia, and government).
According to the statement, Malaysia continues to emerge as one of Asia’s most dynamic electronics and semiconductor hubs, supported by strong manufacturing capabilities, deep integration into global supply chains, and a growing presence of multinational companies.
The country’s established strengths in assembly, testing, and semiconductor packaging, combined with increasing momentum in artificial intelligence (AI), high-performance computing, communications, power and automotive electronics, present significant opportunities for global companies to expand market access and partnerships across Southeast Asia.
As the industry is evolving fast into the heterogeneous integration of processors, memory, sensors, control and power devices and system-level innovation, the association sees the need for greater ecosystem coordination and globally aligned frameworks is becoming increasingly important to support scalability, interoperability, and long-term competitiveness.
This MoU also builds on the Global Electronics Association’s growing presence in Malaysia, reflecting its commitment to supporting innovation and industry development in one of the region’s key electronics hubs.
“Malaysia’s electronics and semiconductor industry is entering a critical phase of transformation, driven by the growing complexity of next-generation technologies and the shift towards advanced electronic packaging,” said Afdzal Syahadat Husin, Chief Executive Officer, MIMOS Technologies Sdn Bhd.
According to him, this collaboration reflects a shared commitment to strengthening Malaysia’s position within the global value chain by fostering deeper industry alignment, accelerating capability development, and advancing the adoption of globally recognized standards and best practices.
“Through this partnership, MIMOS aims to catalyze innovation, enhance ecosystem readiness, and support the nation’s ambitions to become a leading hub for high-value electronics manufacturing in the region,” he added.
Meanwhile, Matt Kelly, Chief Technology Officer and Vice President, Standards & Technology, Global Electronics Association, said AEP is rapidly becoming the backbone of next-generation technologies, from AI and high-performance computing to automotive, power and communications systems.
“Strengthening industry collaboration and developing globally aligned guidelines and standards will be critical to unlocking Malaysia’s full potential in this space,” he added.
Dr. Ranee Ramya, Country Manager – Malaysia, Global Electronics Association, added Malaysia’s electronics industry is at a pivotal stage of growth, with increasing focus on advanced and high-value manufacturing segments.
“Strengthening industry alignment, advancing standards adoption, and enabling initiatives such as CQI programs and validation services are critical to positioning Malaysia as a leading hub for advanced electronics in Southeast Asia,” he added.
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