Hanic, a Singapore-based semiconductor technology firm, has announced a strategic expansion in Penang, Malaysia, to establish a center for integrated circuit (IC) design and advanced packaging design.
InvestPenang said in a statement on Wednesday that the new hub will focus on high-growth sectors, including artificial intelligence (AI)-driven chip architectures and next-generation heterogeneous integration.
By combining front-end design with back-end and advanced packaging design capabilities, Hanic aims to provide a true seamless one-stop solution, significantly reducing time-to-market for global customers in the data center, edge AI, automotive and communications industries.
This expansion, supported by InvestPenang, marks a significant milestone in Hanic’s global growth and reinforces Penang’s status as the “Silicon Valley of the East.”
The expansion is expected to create over 60 high-value engineering jobs in the near future, focusing on digital and analog designs, design verifications, physical designs and advanced 2.5D/3D packaging designs.
“Building on five decades of industrial excellence, Penang continues to strengthen its position as the Silicon Valley of the East by advancing into next-generation technologies,
“Hanic’s investment in IC Design and Advanced Packaging Design aligns strongly with Malaysia’s National Semiconductor Strategy to deepen front-end design capabilities and enhance advanced packaging competencies,” said Chow Kon Yeow, Chief Minister of Penang.
He said through initiatives such as Penang Silicon Design @5KM+ (PSD@5KM+), the are building an integrated ecosystem that connects design, testing and manufacturing.
“Hanic’s presence will further enhance our innovation capacity, create high-value talent opportunities, and generate positive technological spillovers for the state,” he added.
Dr Oh Ser Wah, General Manager of Hanic, commented Penang offers a unique synergy of decades-long electronics manufacturing excellence and a burgeoning design ecosystem.
“With Hanic’s strong track records including delivering the first 3D IC for a major country in this region, our expansion here is a strategic move to be at the heart of the semiconductor revolution,
“With the support of InvestPenang, Hanic is committed to nurturing local talent and pioneering innovations in IC design and advanced packaging that will define the next decade of computing performance,” he added.
Hanic’s Penang office is currently ramping up hiring across multiple domains in system-on-chip (SoC) designs, design verifications, physical designs, design-for-test (DFT) and advanced packaging designs.
At the same time, Hanic is also in discussion with various partners to define the roadmap for advanced packaging.