US tech firm Micron Technology, Inc. will invest $24 billion over ten years to advance wafer fabrication facility in Singapore.
The firm which has broken ground on the advanced wafer fabrication facility located within the company’s existing NAND manufacturing complex in Singapore, said the new facility is designed to ultimately provide 700,000 square feet of cleanroom space.
Wafer output is scheduled to begin in the second half of calendar 2028, helping Micron address growing market demand for NAND technology driven by the rapid expansion of AI and data-centric applications.
“Micron’s leadership in advanced memory and storage is enabling the artificial intelligence (AI)-driven transformation reshaping the global economy,
“This investment underscores Micron’s long-term commitment to Singapore as an important hub in our global manufacturing network, enhancing supply chain resiliency and fostering a vibrant ecosystem for innovation,” said Manish Bhatia, executive vice president of global operations at Micron Technology.
According to the statement, this new fab will become an integral part of Micron’s NAND Center of Excellence in Singapore.
The facility provides the essential capacity to support continued technology transitions, positioning Micron to meet long-term demand for advanced storage solutions.
Additionally, co-locating research and development (R&D) with manufacturing improves efficiencies, accelerates time-to-market and deepens research partnerships between industry and academia.
Micron’s previously announced high-bandwidth memory (HBM) advanced packaging facility, also located in the same Singapore manufacturing complex, is on track to contribute meaningfully to Micron’s HBM supply in calendar year 2027.
As HBM becomes a part of Micron’s Singapore manufacturing footprint, the company expects opportunities for synergies between NAND and DRAM production.
Micron said it will maintain flexibility in managing the pace of capacity ramps in the new facility to align with market demand.
Micron’s advanced wafer fabrication facility investment will create around 1,600 jobs.
Combined with the previously announced 1,400 jobs from the HBM advanced packaging facility, the firm’s expansion will support about 3,000 new Micron jobs total.
These positions will focus on fab engineering and operations, integrating AI, advanced robotics and smart manufacturing technologies to enhance efficiency and innovation.
“Micron’s latest expansion will strengthen our semiconductor ecosystem and further anchor Singapore as a critical node in the global semiconductor supply chain,
“This investment rides on growth in AI and will provide good jobs for Singaporeans. Micron’s advanced facility will leverage advanced robotic automation and boost our advanced manufacturing ecosystem, helping our workforce seize new opportunities,” said Jermaine Loy, managing director of the Singapore EDB.
The fab will comply with the company’s sustainability commitments and build on the site’s recognition as both a World Economic Forum Sustainability Lighthouse and an Energy Efficiency National Partnership (EENP) Award recipient.
The fab will also adhere to LEED standards, such as greenhouse gas abatement, water recycling and waste circularity.
In collaboration with academia and ecosystem partners, Micron said its investment creates opportunities to build a future-ready semiconductor workforce through multiple pathways, offering real-world learning experiences such as internships for students, upskilling the current workforce in AI and smart manufacturing, and advancing R&D talent development to drive future innovation.
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