Nsc, an integrated circuit design company in Singapore, has on Wednesday announced its strategic partnership with In-Q-Tel (IQT), the not-for-profit strategic investor for the U.S. national security community and America’s allies.

This interim round follows nsc’s first round of funding completed in July 2021 for $6.5 million, which was led by Openspace and SG Innovate, nsc said in a statement.

According to the statement, the strategic partnership with IQT will continue to accelerate nsc’s path towards commercialization and international engagement, allowing nsc to capitalize on multiple key customer interests.

“This partnership is a significant boost to nsc’s growth journey,

“It signifies a major milestone for the company and opens a plethora of possibilities and exciting opportunities towards further commercial success,” said Fayyaz Singaporewala, Chief Executive Officer and Co-Founder of nsc.

It is noted that IQT identifies, evaluates, and leverages emerging commercial technologies to deliver best-in-class capabilities, insights, and other services to government partners through a unique global investment platform.

By leveraging on IQT’s deep global expertise across multiple domains, nsc will expand its international engagement for both supply chain and potential customers as well as drive
scalability of its technology for exciting end applications.

One of the uses for nsc’s chips is microdisplays, which has wide uses across multiple electronics domains, including heads-up displays, virtual reality (VR) headsets, augmented reality (AR) glasses and wearables.

“Our investment in nsc underscores our commitment to driving semiconductor innovations that enhance the human experience,” said Justin Wilder, Managing Director of IQT Singapore.

According to him, nsc’s cutting edge innovation across integrated circuit design, integration, and manufacturing is poised to accelerate the smart lighting, AR/VR display, and wireless communications industries.

“We are excited to support their continued growth and success,” he added.

The strategic partnership is also complemented by Openspace’s strong footprint in Southeast Asia and their focus on businesses with a compelling vision for expansion.

“Openspace has been tracking nsc’s journey since 2016 and made the decision to lead the funding round in 2021 as the company moved towards commercialization,

“We are very excited to be backing this company, which is a strong reflection of the thriving deep tech innovation coming out of the Singaporean research and development (R&D) ecosystem,” said Hian Goh, Founder and General Partner of Openspace.

As seen through the rise of AR / VR, nsc noted consumer technologies are increasingly focused on delivering a seamless human experience for users to interact more vibrantly with the world around them.

To do so, it said new types of integrated chip technologies that can deliver outsized performance and novel functions are required.

Since it began commercial operations in 2021, nsc said it has been delivering a first-of-their-kind integrated solution.

It is noted that the firm is led by a team of four Co- Founders who bring decades of combined industry and commercial experience from AT&T Bell Labs, Massachusetts Institute of Technology, GlobalFoundries, AmberWave Systems and Singapore-MIT Alliance for Research and Technology.

Nsc also said its unique and proprietary technology monolithically integrates Silicon CMOS and III-V, making possible new innovations in product, system and software design.

It said its integrated chips embed III-V devices, such as GaN LEDs, at high density inside of silicon wafers, allowing for superior performance and more complex optoelectronic and wireless systems.

The resulting chips are suited for multiple near-term, high-growth markets such as smart lighting, AR / VR displays and advanced wireless communications, according to the firm.

Importantly, it said its approach maintains compatibility with existing Silicon CMOS manufacturing infrastructure to ensure scalability and rapid adoption.

In addition, there is strong focus on developing core IP across the entire tech vertical from materials to applications, it added.

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